Dr. Jianbiao John Pan's Homepage
Jianbiao John Pan, Ph.D., CQE, CRE
Professor
Industrial and Manufacturing Engineering
California Polytechnic State University
San Luis Obispo, CA 93407
Office: Building 192 Room 235
Phone: (805) 756-2540
Email: pan@calpoly.edu
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Dr. Jianbiao John Pan is a professor in the Department of Industrial and Manufacturing Engineering at California Polytechnic State University (Cal Poly), San Luis Obispo, CA. He received a Ph.D. degree in Industrial Engineering from Lehigh University, Bethlehem, PA, USA, a M.E degree in Manufacturing Engineering from Tsinghua University, Beijing, China, and a B.E. degree in Mechatronics from Xidian University, Xian, China. He worked at the optoelectronics center of Lucent Technologies/Agere Systems as a member of technical staff between 2000 and 2002. He is an ASQ-Certified Quality Engineer and an ASQ-Certified Reliability Engineer.
Dr. Pan's research interests lie in materials, process, thermal management, and reliability of microelectronics and electronic packaging, especially on environmentally benign microelectronics packaging and reliability including lead-free soldering and LED packaging. His teaching interests include electronics manufacturing, microelectronics and electronic packaging, statistical data analysis, design and analysis of experiment, quality engineering, and reliability engineering. He has authored or co-authored over 40 technical papers. He is a Fellow of the International Microelectronics and Packaging Society (IMAPS), a senior member of the Institute of Electrical and Electronics Engineers (IEEE), a senior member of the American Society for Quality (ASQ), and a senior member of the Society of Manufacturing Engineers (SME).
Dr. Pan is a recipient of the 2011 Outstanding Educator Award from the IMAPS and the 2004 M. Eugene Merchant Outstanding Young Manufacturing Engineer Award from the SME. He is currently the Editor-in-Chief of Journal of Microelectronics and Electronic Packaging and a guest Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.