Dr. John Pan's Teaching
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Courses:
IME 156 Basic Electronics Manufacturing
Course Description:
Practical electronics manufacturing knowledge expanded through concepts such as CAD/CAM design, Design for Manufacture (DFM), documentation requirements, prototyping and production planning. Hands-on techniques learned for project planning, soldering, automation, hand tool usage and production methods. 1 lecture, 1 laboratory.
IME 157 Electronics Manufactuirng
Course Description:
Printed circuit board assembly; printed circuit board fabrication process; electronics packaging; overview of semiconductor manufacturing; design, documentation and fabrication of electronic units with emphasis on CAD/CAM. Open to all majors. 2 lectures, 2 laboratories.
IME 326 Engineering Test Design and Analysis
Course Description:
Data gathering and statistical testing applied to industrial engineering and manufacturing fields. Experimental methods for product and process evaluation and comparisons; interpretation of engineering data. Engineering experimental design, linear and nonlinear regression, ANOVA, and multifactor ANOVA. Utilization of existing computer software. 4 lectures. Prerequisite: STAT 321 with a grade of C- or better.
IME 335 Computer-Aided Manufacturing
Course Description:
Wire-frame, surface, and solid model generation. Benefits, limitations, and selection of CAD and CAM systems. CAD as an input to CAM. Manual, language-based, and graphics-based NC programming. Configuration of CAD/CAM software; post-processor generation. 3 lectures, 1 laboratory.
IME 427 Process Optimization through Designed Experiments
Course Description:
Experiments for optimization of industrial processes: process variables, response, measurements, analysis and interpretations. Statistical principles in design. Design approaches: conventional methods, response surface methodology, and Taguchi methods. Type of experiments: factorial,fractional factorial, mixture, and orthogonal arrays. Design projects using real world problems. 3 lectures, 1 laboratory. Prerequisite: IME 326 or consent of instructor.
IME 430 Quality Engineering
Course Description:
Quality control, reliability, maintainability, and integrated logistic support. Statistical theory of process control and sampling inspection. Risks associated with decisions based on operating characteristics of control charts and sampling plans. Reliability and life testing methods. Economics of statistical QC. Specifications and standards. 4 lectures. Prerequisite: IME 326 or STAT 302.
IME458 Microelectronics and Electronics Packaging
Course Description:
Materials, Processes, and Reliability of microelectronics and electronics packaging, surface mount assembly and printed circuit board fabrication. Overview of semiconductor manufacturing and optoelectronics packaging. Open to all majors. 3 lectures & 1 laboratory. Prerequisite: MATE 210 and PHYS 133, or consent of instructor.
IME 542 Reliability Engineering
Course Description:
Reliability engineering terminology and definitions. Reliability mathematics; probability plotting; load-strength interference and safety margin. Failure distributions and failure rate models. Weibull analysis; bath tub curve; reliability of parts. Reliability of systems; redundancy; reliability allocation. Maintain-ability and availability. Failure modes and effects analysis. Fault tree analysis. Failure data analysis; reliability testing; reliability growth testing. Electronic system, mechanical and software reliability. Safety and human reliability; reliability management. 3 lectures, 1 laboratory. Prerequisite: IME 503.
Tutorials:
PCB Design and Manufacturing Tutorials
Minitab Tutorials for Design and Analysis of Experiments
My Graduate Students:
Tzu-Chien (Jason) Chou, "Effect of Reflow Profile on Lead-free Solder Joint Shear Force", (2006). Currently Procurement Quality Engineer with IBM.
Brian S. Wright, "Designing and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes", Co-advised with Dr. Richard Savage, (2007). Currently Electrical Engineer with Agilent Technologies.
Andrew J. Farris, "Drop Impact Reliability Testing Lead-free Chip Scale Packages", Co-advised with Dr. Albert Liddicoat, (2008). Currently Research Scientist with Lockheed Martin Aeronautics.
Minh-Nhat Ba Le, "Advanced Thermosonic Wire Bonding using High Frequency Ultrasonic Power: Optimization, Bondability, and Reliability", (2009). Currently Senior Design Engineer at Western Digital.
Michael S. Krist, "The Design and Manufacture of a Light Emitting Diode Package for General Lighting," (2010). Currently Industrial Engineer at Defense Microelectronics Activity.
Christopher Grasberger, "The Study of the Forward-Voltage to Junction-Temperature Coefficient Degradation in Light-Emitting Diodes," (2010). Currently with Seesmart.
Ronald Sloat, in progress