Dr. John Pan's Research
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My research interests are in materials, process, thermal management, and reliability of microelectronics and electronic packaging, especially on environmentally benign microelectronics packaging and reliability including lead-free soldering and LED packaging.
Honors and Awards:
- Outstanding Educator Award, the International Microelectronics and Packaging Society (IMAPS), 2011.
- Fellow, International Microelectronics and Packaging Society, 2009.
- 1st Place, IPC�s worldwide Academic Poster Competition, March 31 � April 2, 2009, Las Vegas, NV.
- Invitee, National Academy of Engineering Frontiers of Engineering Symposium, 2007.
- Highly Commended Winner, the Emerald Literati Network Awards for Excellence 2007, for the paper titled "The effect of reflow profile on SnPb and SnAgCu solder joint shear strength" published in Soldering & Surface Mount Technology, Vol. 18, No. 4, pp. 48-56, 2006.
- M. Eugene Merchant Outstanding Young Manufacturing Engineer Award, the Society of Manufacturing Engineers (SME), 2004.
- Best Paper in Session, J. Pan, R. M. Pafchek, F. F. Judd, and J. Baxter, �Effect of Chromium-Gold and Tantalum-Tantalum Nitride-Platinum-Gold Metallization on Wire/Ribbon Bondability,� IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium, San Jose, CA, 2004.
- Graduate Student of the Year, Dept. of Industrial & Systems Engineering, Lehigh University, 2000.
- First Prize for Student Poster, IMAPS Keystone Chapter, 1999.
- Outstanding Student Officer Award, SME Region 3, 1998.
- Graduate Fellowship, Lehigh University, 1996 � 1997.